Intel Xeon Gold 5218 Processor
QAR 239.00QAR 265.00 (-10%)
- Processor: Intel Xeon Gold 5218 CPU
- Total Threads: 32
- Total Cores: 16
- Base Frequency: 2.30 GHz
- Max Turbo Frequency: 3.90 GHz
- Cache: 22 MB
- Memory Type: DDR4
- Max RAM: 1 TB
- Max Memory Bandwidth: 128 GB/s
- TDP: 125 W
- Bus Speed: 10.4 GT/s
Are you looking for a robust processor to elevate your server’s performance for rigorous, virtualized data center workloads? The Intel Xeon Gold 5218 processor, built on the Cascade Lake architecture, is a part of the 2nd Gen Intel Xeon Scalable processors that are specifically designed for high-demand workspaces. With 16 cores, 32 threads, boost speed of up to 3.90 GHz, this Xeon Gold 5218 2.30 GHz utilizes advanced technologies like Intel Hyper-Threading Technology, Intel DL Boost, Intel AVX-512, and Intel Virtualization (VT-x, VT-d), ensuring virtual machines and memory-intensive workloads run flawlessly. With 22MB of Intel Smart cache, this Xeon Gold 5218 supports up to 1TB of DDR4-2666 memory over six channels and delivers outstanding throughput and multitasking capabilities with exceptional memory bandwidth. This CPU also supports 48 PCIe 3.0 lanes and dual-socket configurations on FCLGA3647 platforms for large-scale deployments. ServerBasket offers the best deals on these new Intel Xeon Gold 5218 CPUs at a budget-friendly price. Get remote installation services, 24/7 tech assistance, and free shipping all over Qatar for a seamless experience.
Technical Specifications
| Brand | Intel |
|---|---|
| Product Type | Processor / CPU |
| Microarchitecture | Cascade Lake |
| Total Cores | 16 |
| Total Threads | 32 |
| Base Clock Speed | 2.3 GHz |
| Max Turbo Frequency | 3.9 GHz |
| Cache Memory | 22 MB Intel Smart Cache (L3) |
| Memory Type | DDR4-2666 MHz ECC Registered DIMMs |
| Maximum Memory Capacity | 1 TB |
| Maximum Memory Bandwidth | 128 GB/s |
| Memory Channels | 6 |
| QPI / UPI Links | 2 UPI |
| PCI Express Version | 3 |
| PCIe Lanes | 48 |
| Socket Type | FCLGA3647 |
| Max CPU Configuration | 2 processors (dual socket) |
| TDP (Thermal Design Power) | 125 W |
| Die Size | 14 nm |
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